Zeissgroup

Application Engineer

In short

This role provides solutions-based technical and application support to the RQS team in Taiwan, covering customer requirement analysis, tool demonstrations, trade shows, customer training, and pre/after-sales assistance, while collaborating with sales and R&D on new process development. It requires an advanced degree (M.S./Ph.D.) in Material Science, Physics, or Engineering, 5+ years of experience with FIB & SEM, EDS, EBSD, and TEM lamella preparation, and fluency in Chinese and English. The job is based onsite in Hsinchu City and involves domestic and international travel.

This position is responsible for providing solutions-based support to the RQS team in Taiwan through understanding of customer requirements, tool demonstrations, trade show participation, customer training, and pre & after-sales technical assistance, also working closely with leading customer on the new process development and technical engagement, developing application business together with sales and product R&D team.
•Understanding of Customer Requirements: Based on customer's High Value Problems, requests, application needs, budget, and other information to determine the hardware and software that best meet customer needs.
•Tool Demonstrations: Tool demonstration for prospective customers when tool is available for demonstration. Travel with customer to demo centers if requested and needed.
•Trade Show Participation: Attend and participate in regional trade shows / exhibitions. Duties include helping set up exhibits, show case RQS equipment, networking with prospective customers, and etc.
•Customer Training: Conduct training sessions for customers. Training covers use and operation of the RQS systems. Training may be at corporate facility or customer site.
•Pre & After Sales Support: Assist sales team with technical presentation and pre-sales works. Support the customer via telephone and on-site visits to ensure that the customer is receiving the maximum benefit from the Zeiss equipment.
Education
•An advanced degree (M.S. / Ph.D.) in Material Science, Physics, or Engineering related discipline
Experience
•5+ years relevant experience on FIB & SEM, EDS, EBSD, TEM lamella preparation
•Semiconductor relevant background is a plus.
Other skills
•Excellent interpersonal communication, team player, self motivated, strong analytical skills, and fluent in Chinese and English
•Reporting and presentation skill
•Project or cross-functional communication experience.
•Prior experience with MS office tools (ppt, excel, project).
•Willingness to travel domestic and internationally.
•3D Tomography knowledge
•Matlab, Python, C++ coding skill is a plus
•TOEIC 650+

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