Zeissgroup

SFS Advanced Packaging Application Engineer

In short

ZEISS, a global optics and optoelectronics technology company, is hiring an SFS Advanced Packaging Application Engineer in Yongin to validate next-generation 3D X-ray systems and develop advanced semiconductor packaging applications. The role bridges customers and R&D, delivering on-site technical support, testing, documentation, and troubleshooting for new tools, with domestic and international travel (US, EU, TW) required. It requires a Master's degree in a related technical field, at least 3 years of lab test or metrology qualification experience in semiconductor, and hands-on experience with 3D X-ray systems and back-end/advanced packaging processes.

About ZEISS
ZEISS is technology and innovation. Founded in Germany, in 1846, ZEISS is an internationally leading technology enterprise operating in the optics and optoelectronics industries across 50 countries.
As a company wholly owned by a foundation, ZEISS is committed to responsibility in all its activities. As a pioneer in scientific optics, its employees across the globe continue to push the boundaries of what is possible. With a strong focus on quality and innovation, ZEISS creates value for its customers and helps shape new ways of seeing the world.
We're looking for a SFS Advanced Packaging Application Engineer to join us in Yongin. (Domestic & International Travel (US, EU, TW) as required)
ZEISS Korea has played a key role in the Korean market for the past 40 years. For ZEISS, the Korean Market is one of the Top 5 Global Sales Markets, providing products and services from business areas to Korean customers:
•Semiconductor Manufacturing Technology
•Industrial Quality & Research
•Medical Technology
•Vision Care (Consumer Markets)
Your Role
In this role, you will serve as a technical bridge between customers and the R&D team by validating next-generation ZEISS 3D X-ray systems, developing advanced semiconductor packaging applications, and delivering on-site technical solutions to ensure successful tool qualification and customer adoption.
The role of SFS Advanced Packaging Application Engineer will involve:
•Active technical support to develop customer's new application and to solve customer's troubles on new ZEISS tool
•Tests, validation and documentation of system (and software) capability and short-comings
•Development of new application guidelines for usage of new systems
•Evaluation of test results, interpretation and, if necessary, suggestions and opinions for alternative implementation options
•Technical feedback to development team to improve system and system-software
•Validate test data and write test reports
•Other duties, as assigned
•International travel (US, EU, TW) as required
Your Experience
•Master's degree in Materials Science, Mechanical Engineering, Electrical/Electronic Engineering, Physics, Semiconductor Engineering, or a related technical field
•Has a minimum of 3 years related working experience in lab test or metrology qualification in semiconductor industry
•Experience with 3D X-ray systems in semiconductor applications
•Good understanding of semiconductor processes, particularly back-end processes and advanced packaging
•Experience in generating test procedures
•Experience in trouble shooting for a prototype system
•Relevant experience in X-ray / CT industry
•Experience in X-ray related tests & qualifications
•Experience with ZEISS x-ray systems and/or ZEISS evaluation software is a plus
•Experience in customer-facing communication
It would be desirable if you had:
•Good hands-on skills, have willingness to test and use early-stage hardware & software, also in front of customer
•Self-motivated and open-minded with a high degree of responsibility
•Strong teamwork spirit
•Good English written and oral skills
•Ability to build strong collaborative relationship with customers
•Willingness for international travel (US, EU, KR, TW)
Your Benefits
If you join ZEISS, you will have access to a range of benefits, including:
•Financial & Lifestyle: Annual flexible welfare points and family support allowances
•Health & Mental Well-being: Comprehensive group medical insurance, executive health screenings at general hospitals, and Employee Assistance Program (EAP) for stress management
•Family & Life Milestones: Tuition assistance for college-aged children as well as compassionate/congratulatory paid leave and financial gifts for major family occasions
•Long-term Growth & Community: Tenure-based long-service awards and retirement benefits, alongside company sponsorship for internal club activities
Role Details
•Division: Semiconductor Manufacturing Technology
•Location: Yongin (Domestic & International Travel (US, EU, TW) as required)
•Contract: Regular

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