Intel

Product Quality and Reliability Engineer

In short

A semiconductor reliability engineering role at a large chip manufacturer, developing reliability models and risk assessments to support qualification and launch of advanced semiconductor products. The work spans device physics, failure mechanism analysis (EM, TDDB, BTI, HCI, package degradation), statistical analysis, and data science, collaborating with design, process, manufacturing, and foundry teams. Requires an MS/PhD in a relevant engineering/science field with 2-5 years of experience (or 5+ years with a B.Tech), plus proficiency in Python, JMP, MATLAB, or Minitab.

Job Description
The Product Quality and Reliability Modeling Engineer develops reliability models and risk assessments that enable successful qualification and launch of advanced semiconductor products. Working across Product Quality & Reliability, Design, Process, Manufacturing, and Foundry teams, this role applies device physics, reliability engineering, statistical analysis, and data science to predict product reliability, identify risks, and drive data-driven decisions throughout the product lifecycle.
Key Responsibilities
•Develop and execute reliability models to assess product lifetime and qualification readiness.
•Evaluate failure mechanisms including EM, TDDB, BTI, HCI, thermal and package-related degradation.
•Analyze qualification, characterization, and manufacturing data to quantify reliability risk.
•Conduct reliability projections, scenario analysis, and risk assessments for new product features and technologies.
•Drive cross-functional investigations and resolution of reliability concerns.
•Improve modeling methodologies, automation, and predictive analytics capabilities.
•Present reliability recommendations to technical and management stakeholders.
Qualifications
Minimum Qualifications
•MS or PhD in Electrical Engineering, Physics, Materials Science, Reliability Engineering, or related field.
•Experience of 2-5 years with M.Tech/PhD and B.Tech with 5+ years.
•Strong understanding of semiconductor device physics and advanced packaging.
•Experience in reliability modeling, accelerated stress testing, and qualification methodologies.
•Knowledge of EM, TDDB, BTI, HCI, package reliability, and wear-out mechanisms.
•Proficiency with Python, JMP, MATLAB, Minitab, or equivalent analytical tools.
•Strong statistical, problem-solving, and communication skills.
•Experience in reliability validation, product development, test engineering.
Preferred Qualifications
•Experience supporting PRQ/qualification decisions.
•Experience with advanced node or advanced packaging technologies.
•Knowledge of AI/ML techniques for reliability prediction.
•Demonstrated technical leadership across complex product programs.
Ideal Candidate
A self-driven engineer capable of independently leading reliability assessments, influencing qualification decisions, and driving risk closure across multiple semiconductor product programs.
Job Details
•Job Type: Experienced Hire
•Shift: Shift 1 (India)
•Primary Location: India, Bangalore
•Work Model: This role will be eligible for the hybrid work model, which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

Stop applying.
Get referred.

$10 in free credits

In just 60 seconds, fully on autopilot — Eraldt's AI agents read your CV, map the roles you fit, find live vacancies and the people who can refer you, write personal emails, and get you referred.

This isn't an application: your CV doesn't go to the company, and we don't promise a referral for this exact role.

Discover who else lands interviews on autopilot