The Role and Impact
As a Module Engineering PhD Intern, you will play a key role in developing and optimizing semiconductor manufacturing processes for a specific module. You will gain hands-on experience by sustaining and improving manufacturing equipment, troubleshooting issues, and supporting qualification activities. This internship offers a unique opportunity to apply your academic knowledge, build practical skills, and contribute to real-world projects in a dynamic environment that fosters growth and innovation.
Business Group
Intel Foundry is focused on advancing semiconductor manufacturing technologies and delivering innovative solutions to meet customer needs worldwide. As part of this organization, you will join a group dedicated to sustaining high-performance manufacturing processes and driving process optimization to support Intel's broader mission of technological excellence.
Key Responsibilities
•Support the development and implementation of manufacturing processes for a specific module in semiconductor production.
•Sustain and enhance manufacturing equipment performance to ensure operational reliability and efficiency.
•Assist in troubleshooting equipment issues and performing qualification activities to achieve production standards.
•Collaborate with engineering teams to optimize process control methodologies and enhance process efficiency.
•Apply statistical analysis and experimental design to improve process reliability and throughput.
•Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM.
•Contribute to continuous improvement initiatives for process control systems and methodologies.
Minimum Qualifications
•Currently pursuing a Ph.D. degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field.
•Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.
•Familiarity with statistical data analysis and experimental design methodologies.
•Experience in materials and physical device characterization techniques like SEM or TEM, gained through coursework, academic research, or hands-on training.
Preferred Qualifications
•Expertise in advanced semiconductor device structures, fabrication techniques, and process integration.
•Proficiency in statistical analysis tools and programming languages such as JMP, Python, MATLAB, or C++.
•Hands-on research experience in device fabrication, physical characterization, or materials testing.
•Strong foundational knowledge in process control systems and semiconductor device physics.
Job Details
•Job Type: Student / Intern
•Shift: Shift 1 (United States of America)
•Primary Location: US, Oregon, Hillsboro
•Position of Trust: N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
